Question about the instructions in your README, you say that once you're done with the top side, repeat for the bottom, but when you're working on the bottom side, what stops the elements on the top side from falling off once the heat passes through the board and melts the solder on that side?
Basically you're hoping the bottom side doesn't get hot enough for everything to move or fall off.
They are 4x the size though, almost exactly double in both length and width.
And this PCBA will be smaller than the battery in most applications anyway.
Its of format of original ESP8 so you get serial + 3 IO pins
Very nice.
The Sense versions are pretty rad. Now I only have to add a battery and a touch sensor and I'm good to go.
I’m tempted to try a few of these just to see how disastrous my build efforts are.
Seriously? For a tiny board like this also? Genuine question.
Edit: Nevermind, I was wrong. I see now that the sizes don't actually directly correspond to the number codes! 01005 is 0.4mm x 0.2mm and 0402 is 1mm x 0.5mm. That's annoyingly confusing, IMO.
https://github.com/PegorK/f32#building-the-f32
It looks doable, but of course a lot of carefulling is required when placing the components.
inch 0402, 0201, 01005, 009005, 008004, $1
mm 1005, 0603, 0402, 03015, 0201, 01005
I love this. Fun and insightful article. Thank you.
Other than that, hugely impressive project of course, it makes any board I've tried to design/assemble look impossibly huge. :)